RT @wallstengine: TSMC DEVELOPS EMIB-LIKE PACKAGING $TSM is working with substrate maker Kinsus on a silicon-bridge technology designed to support larger multi-die AI chips and provide an alternative to its capacity-constrained CoWoS process. The project remains in its early stages, with no commercial launch timeline. Intel’s EMIB has gained interest as chipmakers seek additional packaging capacity and supplier diversification. Nvidia is evaluating it for a future processor combining four GPUs, while Google has reportedly ordered Intel to package more than 3 million custom AI processors in 2028. The competitive risk for TSMC is that packaging could give Intel an entry point to deepen customer relationships and eventually compete for chip-manufacturing orders. Source: The Information
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