The market is conflating three different kinds of "glass." What does this actually mean for Corning $GLW? A report made the rounds over the past couple of days: the first generation of CoPoS won't use a glass substrate, and TSMC has no plans to use a glass interposer either. A lot of people's first reaction was: is Corning (GLW) finished? I read through the report and several follow-up pieces, and the real issue is that everyone is running the timeline too fast — and treating three completely different kinds of "glass" as if they were the same thing. 1. Glass carrier — a product that's in demand right now Its main use is temporary bonding during wafer thinning, Fan-Out, and 2.5D/3D packaging: the glass carrier temporarily supports the wafer or panel (the reconstituted carrier) during proc
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