3 things i'm watching in AI infra companies this week: 1. $ASML reports wednesday. it stopped giving bookings this year, so the line that matters is whether it holds its €43-45B outlook for 2026. it guided €11-12B for Q3 ASML is also reportedly raising spare-part prices 10% in korea from january (the elec, unconfirmed). clearly it has pricing power even on the installed base 2. TSMC reports thursday. i'll be listening for how much of CoWoS it keeps handing out. it just signed globalfoundries to make US interposers, $2B over five years, ramping in 2028 3. taiwan press says chip packaging and test prices are seeing their biggest rise ever. no company has put a number on it yet. if ASE or KYEC confirm a rate, packaging is still the tight part interesting week ahead!
在 X 查看 ↗