TSMC advanced packaging: A single CoWoS wafer now costs US$10,000 due to the shortage and high demand as it is vital to high-performance AI chips, media report. The high price means profits for TSMC because packaging equipment is far less expensive than fab equipment, meaning lower capex per-unit. TSMC’s 2026 CoWoS capacity is seen at 1.3 million wafers (total), and 2.0M in 2027. Advanced packaging accounted for around 10% of TSMC’s 2025 revenue. $TSM $BESI #Advantest #ASMI $AMAT $KLAC #semiconductors https://t.co/6CAjf1E68O
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